Automotive radar sensor chips and related packaging technology development

The automotive radar system is mainly composed of an antenna, a front-end radar sensor, and a back-end signal processor. The current automotive radar sensor systems are basically implemented using integrated circuit technology. In this article, we will discuss in detail the development of automotive radar sensor chips and related packaging technologies.

The radar sensor chip is mainly composed of three parts:

1) Main chip (MCU, DSP, FPGA)

2) Radar chip (MMIC, ASIC)

3) Other auxiliary chips (PMIC, ADC, PA)

Ultrasonic radar chip

Its module is mainly composed of MCU, ultrasonic radar sensor chip, and PMIC chip. Due to the small amount of processed data and low price requirements, the chip packaging type is generally dominated by traditional wire-bonding packaging.

Millimeter-wave radar chip

Its module is mainly composed of a DSP chip, millimeter-wave radar sensor RFFE MMIC chip, and PMIC. Because the amount of processed data is greater than that of ultrasonic radar, DSP, CPU, or similar functional chips are generally used as fast processors for large amounts of data. Chip packaging types are generally based on flip-chip packaging (Flip Chip) or fan-out wafer-level packaging (eWLB, Fan-out Package). Taking the JCET eWLB Package as an example, compared with fcBGA, the parasitic resistance (Parasitic Resistance) and the induction rate (Inductance) are reduced by 70%, and the parasitic capacitance (Parasitic Capacitance) is reduced by 50%. It can effectively improve electrical properties, reduce power consumption, reduce packaging volume, and save costs.

Lidar chip

Its module is mainly composed of FPGA or ASIC chip, millimeter-wave radar sensor RFFE FMCW, SPAD chip, and PMIC. Due to the huge amount of processed data, FPGA or ASIC chips are generally used as fast processors for large amounts of data. Chip packaging types are generally based on flip-chip packaging (Flip Chip). In addition, system-in-package (SiP) can integrate different functional chips is also a future development trend. In addition to the chip, the lidar module also requires the overall cooperation of lasers, detectors, and optical devices. It has a high technical level, a long development and production cycle, and is expensive. The lidar technology is still in the development stage, and there are many areas that need to be improved and improved, such as reducing the overall cost and opening up the market in other new areas. The lidar market needs to be expanded in the future, especially in the development of driverless cars (L3->L5), which will have great development potential.

Antenna-in-Package (Antenna-in-Package, AiP) is a technology that integrates antenna and chip functions into a package based on packaging materials and processes to achieve system-level wireless functions. AiP technology conforms to the high integration trend of semiconductor technology and provides a good antenna and package integration solution for system-level wireless chips. The latest authoritative market analysis report pointed out that AiP technology will be an important technology for the integration of millimeter-wave 5G communications and automotive radar chip functions. Therefore, AiP technology has received extensive attention recently and will be an indispensable important technology trend.

As a leading chip manufacturer in the industry, Changjiang Electronics Technology is well aware of the importance of various types of packaging technologies to the automotive industry.

In addition to traditional wire-bonding packages (TO, SOP), etc., we also provide various advanced packaging technologies, such as flip-chip packaging (Flip Chip), fan-out wafer-level packaging (eWLB, Fan-out Package), fan-in type Fan-in Wafer Level Package (Fan-in Wafer Level Package), System in Package (SiP), High-Performance Computing Flip Chip Array Package (HPC fcBGA), 2.5D/3D Package, etc., to meet the differences of automotive chip customers demand.

Looking to the future, we will cooperate with customers to provide a complete solution for automotive radar chip packaging and testing and assist the domestic automotive chip industry to flourish.